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There are some operations in which a single part is divided into 2 or more usually smaller parts. Examples of such operations in including cutting, shearing, flame cutting, sawing, and the like. Our selection of the term dicing came from the late 1960's when PROSPAC was first used in a microelectronics plant which produced substrates each of which contained many relatively small identical integrated circuits. At some point in the routing, an operation was defined which "diced" each 10x10 substrate into 100 individual thick film integrated circuit "chips". When creating a new operation on the routing for a work order, the dicing factors always default to 1.0 for that operation.
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